The information marks the end result of a multi-year effort by Samsung to hit this important milestone with out critical delays. Samsung first introduced its GAA design in 2019, calling it MBCFET. That stands for Multi-Bridge Channel Subject Impact Transistor, which is a nanosheet design. That is completely different than Intel’s RibbonFET course of, which makes use of skinny nanowires. TSMC will even be transferring to nanosheets, however not till 2nm. For 3nm it’s sticking with FinFET through a customizable design named FinFlex. TSMC is predicted to start 3nm manufacturing someday in late 2022.
The announcement from Samsung supplied some numbers to quantify the advantages of the transfer to GAA. In comparison with 5nm, its 3nm course of permits for a 45 p.c discount in energy consumption, 23 p.c extra efficiency, and a 16 p.c discount in space. The corporate’s second technology 3nm course of will take issues even additional. It’s promising a 50 p.c discount in energy, 30 p.c extra efficiency, and a discount in space of 35 p.c. Samsung has mentioned beforehand its second technology design will arrive roughly one 12 months after its predecessor. Its first technology 3nm nanosheet design is concentrated on “excessive efficiency, low energy computing” the corporate said. It’s going to then transfer to specializing in chips for cellular purposes.
Samsung’s nanosheet design will permit it to exactly fine-tune the traits of the transistors. By tweaking the width of the sheets, it will probably customise the ability and efficiency curve with extra precision than what FinFET permits. For extra energy/efficiency it will probably use wider sheets, or narrower sheets to enhance effectivity.
To this point Samsung hasn’t introduced any official prospects or merchandise for its 3nm course of. It’s additionally not clear when it’ll start excessive quantity manufacturing, and what sort of yields it’s achieved. Nonetheless, it’s a shot throughout the bow of its important rival TSMC. As famous by Anandtech, Samsung has been shedding prospects to TSMC currently. In Might Qualcomm introduced it was transferring to TSMC for its Snapdragon 8+ Gen 1 SoC. Clearly, Samsung wish to reverse that development, and reaching 3nm is a feather in its cap alongside these efforts, if it will probably get yields up. When TSMC begins 3nm manufacturing later this 12 months, it’ll be attention-grabbing to see how its versatile FinFET design stacks up in opposition to Samsung’s GAAFET. Intel isn’t anticipated to go away the FinFET period till 2024 with its 20A “Angstrom” course of. Like TSMC’s, its Intel 3 node will nonetheless use FinFET.